5/20/2023 0 Comments Altium designer 18 region to padManaging heat distribution and ease of assembly in your board requires properly designing thermal relief pads in your PCB as well as using other methods to manage heat. As copper has high thermal conductivity, it can be difficult to heat pads to the right temperature for applying solder, both in some manual processes and in wave solder processes, especially when pads are connected to an internal plane with a via. A unified PCB design platform that integrates advanced PCB layout features with comprehensive via and pad design features.Īlthough FR4 is a popular substrate due to its low cost and versatility, it creates problems for thermal management due to its low thermal conductivity.
0 Comments
Leave a Reply. |